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Isixhumi samandla ku-micro, chip, modular

Isixhumi samandla sizoba yi-miniaturized, mncane, i-chip, inhlanganisela, imisebenzi eminingi, ukunemba okuphezulu kanye nempilo ende.Futhi badinga ukuthuthukisa ukusebenza okuphelele kokumelana nokushisa, ukuhlanza, ukuvala uphawu nokumelana nemvelo.Isixhumi samandla, isixhumi sebhethri, isixhumi sezimboni, isixhumi esisheshayo, ipulaki yokushaja, isixhumi esingangeni manzi se-IP67, isixhumi, isixhumi semoto singasetshenziswa emikhakheni ehlukahlukene, efana nale. njengamathuluzi omshini we-CNC, amakhibhodi nezinye izinkambu, ezinesekhethi yemishini kagesi ukuze kuqhutshekwe kufakwe okunye esikhundleni sokuvula/ukuvala, isishumeki se-potentiometer nokunye.Ngaphezu kwalokho, ukuthuthukiswa kobuchwepheshe bezinto ezintsha nakho kungenye yezimo ezibalulekile zokukhuthaza izinga lobuchwepheshe. wepulaki kagesi kanye nezingxenye zesokhethi.

Mayelana nokuthuthukiswa kobuchwepheshe bokuhlunga isixhumi samandla

Isidingo semakethe sesixhumi samandla, isixhumi sebhethri, isixhumi sezimboni, isixhumi esisheshayo, ipulaki yokushaja, isixhumi esingangeni manzi se-IP67, isixhumi nesixhumi semoto silondoloze ukukhula okusheshayo eminyakeni yamuva.Ukuvela kobuchwepheshe obusha nezinto ezintsha nakho kukhuthaze kakhulu izinga lokusetshenziswa kwemboni.Isixhumi samandla sivamise ukuba yi-miniaturized kanye nohlobo lwe-chip.Isingeniso sikaNabechuan simi kanje:

Okokuqala, umthamo kanye nobukhulu bangaphandle buncishisiwe futhi buhlukaniswe.Isibonelo, kukhona izixhumi zamandla ezingu-2.5gb /s kanye no-5.0gb /s, izixhumi ze-fiber optic, izixhumi ze-broadband nezixhumi ze-fine-pitch (isikhala singu-1.27mm, 1.0mm, 0.8mm, 0.5mm, 0.4mm kanye no-0.3mm) enobude obuphansi obungango-1.0mm ~ 1.5mm emakethe.

Okwesibili, ubuchwepheshe bokuxhumana obuhambisana nokucindezela busetshenziswa kakhulu ku-cylindrical slotted socket, iphinikhodi ye-elastic strand kanye ne-hyperboloid wire spring socket power connector, okuthuthukisa kakhulu ukuthembeka kwesixhumi nokuqinisekisa ukwethembeka okuphezulu kokudluliselwa kwesignali.

Okwesithathu, ubuchwepheshe be-semiconductor chip buya kuba amandla aqhuba ukuthuthukiswa kwesixhumi kuwo wonke amazinga okuxhumana. Ngokupakishwa kwe-chip yesikhala esingu-0.5 mm, isibonelo, ukuthuthukiswa okusheshayo, kuya ku-0.25 mm isikhala ukwenza i-I level interconnect (yangaphakathi) amadivayisi we-IC kanye Ⅱ Ileveli yokuxhumana (amadivayisi nokuxhumana) kwepuleti enombolweni yamaphini edivayisi ngemigqa eya kumakhulu ezinkulungwane.

Okwesine ukuthuthukiswa kobuchwepheshe bokuhlanganisa kusuka kubuchwepheshe bokufaka i-plug-in (THT) kuya kubuchwepheshe bokukhweza komhlaba (SMT), bese kuya kubuchwepheshe be-microassembly (MPT).I-MEMS ingumthombo wamandla wokuthuthukisa ubuchwepheshe besixhumi samandla nokusebenza kwezindleko.

Okwesihlanu, ubuchwepheshe bokufanisa obuyimpumputhe benza isixhumi sihlanganise umkhiqizo omusha wokuxhuma, okungukuthi isixhumi samandla esingena ngaphakathi, esisetshenziswa kakhulu ekuxhumekeni kwezinga lesistimu.Inzuzo yayo enkulu ukuthi ayidingi ikhebula, kulula ukuyifaka nokuhlakaza, kulula ukuyibuyisela esizeni, iyashesha ukuyixhuma nokuvala, ibushelelezi futhi izinzile ukuhlukana, futhi ingathola ifrikhwensi enhle ephezulu. izici.


Isikhathi sokuthumela: Oct-11-2019